SOLDERING WICK (L:1.5 M, W: 3.5 MM) RL-3515

Περιγραφή

Its emergence greatly reduces the time for rework/repair of electronic products and greatly reduces the risk of thermal damage to the board. 1.imported pure copper material + special chemical formula,efficient tin removal 2.Unique weaving process,copper-absorbing effect and just use a little can remove more solder.